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We can prepare single-layer and multi-layer films of various types, including metal films, dielectric films, semiconductor films, heat-resistant alloy films, hard films, corrosion-resistant films, and transparent conductive films. For instance, we are capable of fabricating perovskite hole transport layers, metal electrodes, and transparent conductive ITO film layers.
A magnetron sputtering coating machine operates by using a strong magnetic field to confine plasma close to the surface of a target material. When a high voltage is applied, ions from the plasma collide with the target, causing atoms to be ejected. These ejected atoms then travel through a vacuum chamber and deposit onto a substrate, forming a thin film. The process allows for precise control over the film's thickness and composition, making it ideal for applications in electronics, optics, and materials science. The use of a magnetic field enhances the efficiency and uniformity of the coating process.
When selecting the thickness of a target for magnetron sputtering, several factors must be considered, including the desired film thickness, deposition rate, and target material. Typically, target thickness ranges from 3 to 6 mm for most applications. Thicker targets (up to 10 mm or more) are used for high-power applications or extended sputtering runs to ensure uniform erosion and longevity. It's crucial to balance target thickness with the system’s power capabilities and cooling efficiency to prevent overheating and ensure consistent deposition. Consulting with the target manufacturer and considering the specific requirements of your sputtering system will yield the best results.
